Industry News

Cadence, Siemens EDA, and startups deploy AI/ML tools for PCB auto-routing and DFM, cutting design cycles by 30-50%.

Updated IPC-1752B material declaration standard adds PFAS substance reporting aligned with EU REACH/RoHS regulatory changes.

NVIDIA's GB300 NVL72 server rack pushes PCB substrate technology to its limits with sub-50µm features and ultra-HDI requirements.

New EU ESPR regulations set recyclability and recycled content targets for electronics, directly affecting PCB design and end-of-life.

Samsung Electro-Mechanics invests $1.2B in ABF substrate capacity to meet surging AI chip packaging demand from NVIDIA and AMD.

AI-driven data center construction is creating unprecedented demand for high-layer-count PCBs. Lead times for 16+ layer boards have extended significantly in Q2 2026, with GPU server and network switch platforms driving the supply squeeze.

The European Chips Act's €43 billion investment is reshaping the continent's semiconductor landscape — and creating unprecedented demand for local PCB manufacturing capacity in HDI, advanced multilayer, and substrate technologies.

Major semiconductor companies are advancing glass core substrate technology for next-generation AI chip packaging, promising superior signal integrity and higher interconnect density. Here's what this shift means for the broader PCB manufacturing ecosystem.

The upcoming IPC-6012 Revision ES introduces significantly tighter requirements for via fill quality, copper plating uniformity, and hole wall integrity. Here's what PCB engineers and manufacturers need to know about the changes and their impact on HDI and high-reliability board production.

IPC Connected Factory Exchange (IPC-CFX / IPC-2591) adoption is accelerating in PCB fabrication plants, enabling real-time machine-to-machine data exchange and full lot traceability — a game-changer for aerospace, medical, and automotive Class 3 board quality.