Early 6G research initiatives are creating demand for specialized PCB materials operating at 100-300 GHz frequencies. Ultra-low loss substrates and glass core technologies emerge as critical enablers.
As chiplet architectures and advanced packaging reshape semiconductor design, the boundary between IC substrate and PCB is blurring. Here's what it means for PCB engineers and manufacturers.
Antenna-in-Package (AiP) technology is revolutionizing PCB design by integrating antennas directly into semiconductor packages. This trend reduces board space requirements by up to 60% while improving RF performance.
The automotive industry's shift to 800V electrical architectures is driving evolution in PCB design standards. New IPC guidelines address creepage, clearance, and material requirements for high-voltage automotive applications.
The global PCB and PCBA market is projected to grow at 5.1% CAGR reaching $182.2 billion by 2036, while LPKF demonstrates rapid prototyping capabilities that could reshape how engineers approach early-stage PCB development.
Major semiconductor suppliers including STMicroelectronics, NXP, Texas Instruments, Infineon, and onsemi have announced price increases effective April-May 2026, citing material, energy, and logistics cost pressures.
A perfect storm of supply shocks, soaring material costs, and a tectonic shift toward AI-driven design is rewriting the rules for hardware creators. Here's what every innovator building the next big thing needs to know.
AI GPU clusters and networking switches demand sub-50μm traces, any-layer microvias, and 20+ layers — driving a manufacturing revolution in PCB fabrication.
India's Production Linked Incentive scheme is attracting billions in PCB manufacturing investment, accelerating China+1 supply chain diversification.
EU and US PFAS restrictions will impact PCB solder masks, conformal coatings, and flux. Here's the timeline, affected materials, and alternatives.
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