Rigid PCB Manufacturing
Custom Rigid PCB Boards 1 to 32 Layers
From simple 2-layer prototypes to complex 32-layer multilayer boards. FR-4, high-TG, and specialty materials with 24-hour rush production available.
Key Advantages
Why Order Rigid PCBs from NimblePCB
Our factory network specializes in every class of rigid board, from hobby prototypes to automotive-grade production.
Full Layer Range
Single-sided through 32-layer boards. Our network includes factories optimized for each layer count range, so you always get the best price-to-capability match.
Multiple Material Grades
Standard FR-4 TG130, mid-range TG150, high-performance TG170, and CEM-1/CEM-3 for cost-sensitive single-layer designs.
Surface Finish Options
HASL, lead-free HASL, OSP, ENIG, immersion tin, immersion silver, and hard gold plating. We recommend the right finish for your application.
Precision Capabilities
Standard 6/6mil down to 3/3mil trace/space. Controlled impedance to +/-5%. Blind and buried vias for high-density designs.
Technical Specifications
Rigid PCB Manufacturing Capabilities
Core Parameters
Our rigid PCB capabilities cover the full range of standard and advanced specifications. Standard parameters are the most cost-effective; advanced options are available at the matched specialty factory.Layer Count
1-32 layers. Most common: 2-layer (45%), 4-layer (30%), 6-layer (15%)
Board Thickness
0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0mm (1.6mm is standard and most cost-effective)
Copper Weight
0.5oz to 6oz (standard 1oz = 35um). Heavy copper available for power applications.
Material
FR-4 TG130/150/170, CEM-1/3. High-TG recommended for lead-free assembly or high operating temperatures.
Max Board Size
610mm x 1200mm single piece. Panelization support for efficient production.
Precision and Testing
Every board is electrically tested. Impedance-controlled boards include TDR measurement reports.Min Trace/Space
Standard: 6/6mil. Fine pitch: 4/4mil. Ultra-fine: 3/3mil (advanced factories).
Min Hole Size
Mechanical drill: 0.2mm. Standard: 0.3mm. Most cost-effective: 0.3mm+.
Surface Finishes
HASL, HASL-LF, OSP, ENIG (most popular for SMT), immersion tin/silver, hard gold fingers.
Special Processes
Blind/buried vias, impedance control (+/-5%), via-in-pad, countersink/counterbore holes, edge plating.
Testing
100% electrical test (flying probe or fixture). AOI inspection. Optional: TDR impedance test, cross-section analysis.
Applications
Industries We Serve with Rigid PCBs
Rigid PCBs are the backbone of electronics across every industry.
Smart home devices, wearables, audio equipment, gaming peripherals.
PLCs, sensor modules, motor drivers, power converters.
Routers, switches, base stations, fiber optic modules.
Infotainment systems, ECUs, battery management, ADAS.
Patient monitors, diagnostic instruments, implant electronics.
Driver boards, control modules, smart lighting controllers.
Design Guidelines
DFM Best Practices for Rigid PCBs
Follow these guidelines to minimize cost and maximize manufacturability.
Trace Width and Spacing
Signal traces: 6mil minimum recommended. Power traces: calculate based on current (IPC-2221). Keep spacing at 8mil+ for standard, voltage-dependent for high-voltage zones.
Via and Hole Sizing
Through-hole vias: 0.3mm min (0.5-0.8mm most cost-effective). Mounting holes: component spec + 0.2mm tolerance. Avoid vias directly on pads unless using via-in-pad process.
Panelization
Recommended panel size: 400x500mm or smaller. Process rail: 5mm minimum per side. Use V-score for straight edges, tab-route with mousebites for irregular shapes.
Layer Stack Optimization
Use 1.6mm total thickness when possible (lowest cost). For 4+ layers, maintain symmetrical stackup. Place ground planes adjacent to signal layers for impedance control.
FAQ
Common Questions About Rigid PCBs
When should I choose 4 layers over 2 layers?
If your board area exceeds 100cm2 with high-speed signals above 50MHz, 4 layers provide dedicated ground and power planes that significantly reduce EMI. For simpler designs, 2 layers cost 40-50% less.
HASL vs ENIG: which surface finish should I choose?
HASL is cheapest and fine for through-hole or large-pitch SMT. ENIG costs 20-30% more but offers flat surfaces essential for BGA, QFN, and fine-pitch components. We recommend ENIG for any design with 0.5mm pitch or finer.
Can 2-layer boards handle 100MHz signals?
Yes, with careful design: maintain a continuous ground plane on the bottom layer, route critical signals on top with ground reference below, use microstrip design for 50-ohm impedance, and keep high-speed trace lengths under 5cm.
What is the most cost-effective board configuration?
2-layer, 1.6mm FR-4 TG130, HASL finish, green soldermask, 6/6mil trace/space, 0.3mm+ vias. Deviating from any of these standard parameters incrementally adds cost.
Ready to Order Rigid PCBs?
Upload your Gerber files for an instant factory-matched quote.Free DFM review included with every order.