Our Services
Full-Spectrum PCB Manufacturing Services
Over 28 years of expertise in PCB prototyping and quick-turn production. NimblePCB delivers a comprehensive range of PCB manufacturing services — from standard rigid boards to advanced rigid-flex, HDI, high-frequency RF, heavy copper, aluminum substrates, and turnkey PCB assembly. No MOQ, fully customizable, with factory-direct pricing.
Why NimblePCB
Manufacturing at Scale
Capabilities
Explore Our PCB Services
From standard rigid boards to specialized high-frequency and HDI manufacturing — eight board types covering every application.
1 to 68 layer boards in FR-4, high-TG, and specialty materials. Prototype to volume production with up to 30 layers for mass orders.
Up to 28 total layers with 16 flex layers for prototypes. Combined rigid FR-4 and flexible polyimide in one board for compact, reliable designs.
Up to 28 layers with 5+N+5 structure. Laser-drilled microvias, 4.5/4.5mil min line/space, and any-layer interconnect technology.
Rogers, Teflon, and hybrid substrates for RF, 5G, satellite, and mmWave applications. Min hole diameter 0.3mm.
Up to 18oz copper for high-current power supplies, inverters, and motor drives. 20/20mil line width/space capability.
Metal core PCBs up to 4 layers with 3.0+ W/m·K thermal conductivity. Min hole diameter 0.25mm for LED and power applications.
Turnkey SMT and through-hole assembly across 5 EMS facilities. Component sourcing, ICT, AOI, and functional testing included.
Advanced embedding technology for miniaturized, high-reliability designs. 4-layer/2.4mm with 0.5mm min hole diameter.
Technical Capabilities
Advanced Manufacturing Specifications
Layer Count & Precision
Our professional R&D capabilities span HDI, multi-layer, rigid-flex boards, embedding technology, and substrate-like processes — delivering the full range from prototype to volume production.FR-4 Boards
Prototype: up to 68 layers. Volume: up to 30 layers. Board thickness from 0.4mm to 3.0mm+.
Rigid-Flex
Prototype: 28 total / 16 flex layers. Volume: 20 total / 12 flex layers.
HDI
Prototype: 28 layers / 5+N+5 structure. Volume: 20 layers / 3+N+3 structure.
Metal Substrate
Up to 4 layers prototype, 2 layers volume. Min hole diameter 0.25mm.
Substrate-Like
Prototype minimum: 30/30 µm line/space. Volume minimum: 40/40 µm line/space.
Finishes, Precision & Quality
Every board undergoes 100% E-testing and automated quality checks. Advanced reliability testing is standard for mission-critical applications.Surface Finishes
HASL, lead-free HASL, immersion tin, immersion silver, ENIG, OSP, and hard gold plating for connectors and gold fingers.
Copper Weight
Standard 1oz (35µm) up to 18oz for heavy copper applications.
Min Trace/Space
Down to 4.5/4.5mil for HDI and fine-pitch designs. 30/30µm for substrate-like technology.
Min Hole Diameter
Laser drill: 0.1mm. Mechanical drill: 0.2mm. Standard: 0.3mm+.
Testing & QA
100% electrical testing and AOI checks. Reliability tests: high voltage, thermal cycling, impedance control, and solderability.
Characteristics & Advantages
What Sets NimblePCB Apart
Professional R&D, quality-certified materials, and flexible manufacturing across seven facilities.
Professional R&D Team
Specialized expertise in HDI, multi-layer, rigid-flex boards, embedding technology, small-size core, and thick copper processes.
Quality-Certified Materials
Approved supplier network including Rogers, Shengyi, DuPont, Rohm & Haas, and Atotech. All materials meet IPC standards.
Flexible Manufacturing
No minimum order quantity across all 7 facilities (2 PCB + 5 EMS). Quick-turn prototypes and volume production from the same network.
Full Certifications
ISO 9001 (quality), ISO 13485 (medical), IATF 16949 (automotive), and UL certifications ensure compliance for any industry.
Materials
Approved Materials Library
Industry-Leading Substrates
We maintain an extensive library of approved materials from top-tier suppliers, ensuring optimal performance for every application — from standard FR-4 to advanced high-speed and high-frequency substrates.Lead-Free / Halogen-Free
Shengyi S1000H, S1000-2, S1150G, S1170G; IT158, IT180A. RoHS-compliant and eco-friendly.
High-Speed
TU872-SLK, TU883, TU933+; Panasonic M4/M6; Shengyi S6N. Optimized for signal integrity at 10Gbps+.
High-Frequency
Rogers RO3003, RO4000 series; Taconic TLY-5, TLX-8; Shengyi SG220/255/300.
Flexible Substrate
RF-775 series; W series; DuPont AG flexible substrates for dynamic flex and high-reliability applications.
Specialty
BT materials, high thermal conductivity substrates, copper-based, aluminum-based, and rigid polyimide (PI) materials.
Applications
Industries We Serve
NimblePCB solutions power innovation across every major electronics sector.
High-layer-count PCBs and HDI boards for AI accelerator cards, GPU clusters, and edge AI modules.
ISO 13485 certified production for diagnostics, patient monitors, wearables, and implantable electronics.
Heavy copper boards for power supplies, solar inverters, EV chargers, and battery management systems.
High-frequency and high-speed PCBs for base stations, optical modules, routers, and satellite systems.
Rugged multi-layer boards for PLCs, motor drives, sensor arrays, and industrial automation controllers.
IATF 16949 compliant boards for ADAS, infotainment, ECUs, and EV power electronics.
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