What is Wangling F4BM2?

Wangling F4BM2 is a ceramic-filled PTFE laminate with Dk 3.5 and Df 0.002 at 10GHz. The ceramic filler provides better dimensional stability and CTE matching with FR-4 compared to pure PTFE (F4B), making it easier to process in hybrid stackups.

F4BM2 has higher Dk (3.5 vs 2.65) due to ceramic filler, which means narrower traces at the same impedance. The trade-off: better CTE match with FR-4, easier processing, and better dimensional stability. Choose F4B for lowest loss; F4BM2 for easier manufacturing and hybrid compatibility.

Ceramic-Filled PTFE

Wangling F4BM2
Ceramic PTFE

Ceramic-filled PTFE with Dk 3.5 and Df 0.002 at 10GHz. Better CTE matching with FR-4 than pure PTFE, easier to process in hybrid stackups. Ideal for 5G antenna, automotive radar, and microwave designs where processability matters as much as performance.

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3.5

Dk (10GHz)

0.002

Df (10GHz)

Wangling (旺灵)

Manufacturer

Ceramic PTFE

Substrate

12-16 ppm

CTE (x,y)

0.25–3.0mm

Thickness

F4BM2 FAQs

What is F4BM2?

Ceramic-filled PTFE laminate (Dk 3.5, Df 0.002 at 10GHz) from Wangling. The ceramic filler improves dimensional stability and CTE matching vs pure PTFE.

F4BM2 vs F4B

F4BM2 has higher Dk (3.5 vs 2.65), meaning narrower traces. Trade-off: better FR-4 CTE compatibility, easier hybrid processing, more dimensionally stable. Choose F4B for absolute lowest loss; F4BM2 for manufacturing ease.

Hybrid stackup compatibility

F4BM2 CTE (12-16 ppm) closely matches FR-4 (14-17 ppm), reducing warpage risk in hybrid builds. Standard FR-4 prepreg bonds well after plasma treatment.

Looking for processable RF performance?

F4BM2 balances RF performance with manufacturing ease. Upload your design for a stackup recommendation.

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