8-Layer PCB

8-Layer PCB
For Serious Hardware

When your FPGA, SoC, or multi-radio design outgrows 6 layers. Full impedance control, multiple reference planes, and room to route without compromise.

[ Photo: 8-layer PCB board ]

Recommended 8-Layer Stackup

L1 Signal (High-Speed) Top routing, BGA breakout
L2 Ground Reference for L1 and L3
L3 Signal Inner routing
L4 Power VCC planes
L5 Ground Reference for L6, power isolation
L6 Signal Inner routing
L7 Ground Reference for L8
L8 Signal Bottom routing, components

[ Photo: 8-layer cross section ]

[ Photo: BGA breakout routing on 8L board ]

[ Photo: impedance test results 8-layer ]

8-Layer Specifications

Min Trace/Space
3/3 mil
Min Hole
0.15mm mechanical
Impedance
±8% TDR verified
Thickness
1.2 - 2.4mm
Material
FR-4 TG150/170
Copper
0.5-2oz per layer
Surface Finish
ENIG/OSP/ImAg
Prototype
8-10 days

FAQs

8-Layer Questions

When should I go to 8 layers?

When you need: 4+ signal layers with continuous reference planes, FPGA/SoC with 400+ pins, DDR4 with matched lengths, or multiple power domains requiring isolated planes.

How much does 8-layer cost?

Roughly 2x the cost of 4-layer for similar board size. Exact pricing depends on your specs — use our instant quote for precise numbers.

Can you do blind vias on 8-layer?

Yes. L1-L2 and L7-L8 blind vias are standard. Buried vias (L2-L7, L3-L6) also available. This approaches HDI territory — contact us for complex via structures.

What material do you recommend?

FR-4 TG170 for most applications. For high-speed (PCIe Gen4+, 10G+ Ethernet), we recommend low-loss FR-4 or Megtron 4. Our engineers can advise based on your signal speeds.

Ready for 8-layer?

Instant pricing. Full impedance control. Engineering review on every order.