Manufacturing Capabilities
Complete PCB Manufacturing Capabilities
Our partner factory network covers the full spectrum of PCB manufacturing — from single-sided prototypes to 30-layer FR-4, 24-layer HDI, and 22-layer rigid-flex boards. Every order receives free DFM review by experienced engineers.
General Specifications
Standard Manufacturing Parameters
Base specifications applicable across all board types. Advanced capabilities available for HDI, RF, and rigid-flex projects.
Layer Count
1 to 30 layers (FR-4). HDI: up to 24 layers. Rigid-Flex: up to 22 layers. Sequential lamination for advanced builds.
Board Thickness
0.2mm to 5.5mm. Standard 1.6mm most cost-effective. Thin boards (0.2–0.8mm) available for flex-rigid.
Min Trace/Space
Standard: 4/4mil (0.1mm). Advanced: 3/3mil (0.075mm). HDI laser: 3/3mil on buildup layers.
Min Hole Size
Mechanical drill: 0.15mm. Laser microvia: 0.075mm. Aspect ratio up to 16:1.
Copper Weight
Outer: 1oz to 5oz (35μm to 175μm). Inner: 0.5oz to 3oz. Heavy copper available for high-current designs.
Board Size
Max board: 1200×600mm. Standard sizes within 600×600mm most cost-effective. Min board: 5×5mm.
Surface Finish
HASL (lead/lead-free), ENIG, OSP, Immersion Tin, Immersion Silver, Hard Gold, ENEPIG.
Impedance Control
±10% or ±8% (with TDR verification). TDR test reports included. Pre-production simulation available.
Solder Mask
LPI solder mask in green, red, blue, black, white, yellow, matte black, matte green. Min dam: 3mil.
Materials
Substrate & Laminate Options
FR-4 Standard (TG130-140)
General-purpose, most cost-effective for consumer and industrial applications.
FR-4 Mid-TG (TG150)
Lead-free assembly compatible. Recommended for automotive and higher-reliability needs.
FR-4 High-TG (TG170+)
For high-layer-count boards, server/telecom infrastructure, and thermal-demanding designs.
Rogers (RO4003C, RO4350B, RT/duroid)
Low-loss RF substrates for 5G, satellite, radar, and mmWave to 77GHz.
PTFE / Teflon
Ultra-low Dk/Df for highest-frequency applications above 10GHz.
Polyimide (Flex)
For rigid-flex constructions. 1-16 flex layers with coverlay or flexible solder mask.
Hybrid Stackup
Mixed FR-4 + Rogers, FR-4 + PTFE combinations for cost-optimized RF designs.
Metal Core (MCPCB)
Aluminum or copper base for LED, power electronics, and thermal management.
Advanced Processes
Specialized Manufacturing Capabilities
Available for projects requiring cutting-edge PCB technology.
Up to 5+N+5 buildup structure. Laser-drilled microvias, stacked/staggered vias, via-in-pad with copper fill. Any-layer interconnect for BGA fanout.
Up to 22 layers. Bookbinder, semi-flex, and multi-zone flex designs. Controlled impedance through flex sections.
Remove via stubs for high-speed channels (>10Gbps). Depth accuracy ±3mil. Essential for 25G/56G SerDes designs.
For power electronics, EV inverters, and high-current busbars. Outer layers up to 5oz, inner layers up to 3oz with fine-pitch signal layers.
Filled and planarized vias directly under BGA pads. Copper-filled or conductive-fill options. Required for 0.4mm pitch BGAs.
Embedded passives (resistors, capacitors) within PCB layers for reduced footprint and improved signal integrity.
Quality Assurance
Certifications & Testing
Every board is electrically tested. Additional inspections available per project requirements.
ISO 9001:2015
Certified quality management system across our partner network.
IPC Class 2 & 3
Standard (Class 2) and high-reliability (Class 3) manufacturing per IPC-A-600 and IPC-6012.
UL Recognized
UL94 V-0 flammability rating. UL-listed materials and processes.
Electrical Testing
100% flying probe or fixture test. Netlist comparison and opens/shorts detection on every board.
Impedance Testing (TDR)
Time Domain Reflectometry reports for all impedance-controlled boards. ±8% tolerance available.
Cross-Section Analysis
Microsection inspection for layer registration, plating thickness, and via quality verification.
At a Glance
Quick Reference Specifications
Layers
1–30 (FR-4). HDI: up to 24. Rigid-Flex: up to 22.
Min Line/Space
3/3mil (75μm/75μm)
Min Mechanical Drill
0.15mm (6mil)
Min Laser Drill
0.075mm (3mil)
Max Aspect Ratio
16:1
Copper Weight Range
Outer: 1–5oz / Inner: 0.5–3oz
Board Thickness
0.2mm – 5.5mm
Max Board Dimension
1200mm × 600mm
Impedance Tolerance
±10% or ±8% (with TDR verification)
Registration Accuracy
±2mil (layer-to-layer)
Solder Mask Alignment
±1.5mil
Minimum Solder Mask Dam
3mil (75μm)
FAQ
Capabilities Questions
What is your fastest turnaround time?
Rush production available: 2-layer boards down to 1-day lead time (4d early). 4-8 layer boards down to 2-3 days. 10+ layer boards down to 3-5 days depending on complexity. Standard lead time: 5–18 days depending on layer count (calendar days, factory runs 24/7).
Do you have a minimum order quantity?
No MOQ — we accept orders from 1 piece for prototypes up to 100,000+ pieces for production. Pricing scales with quantity; best unit cost at 100+ pieces.
Can you manufacture boards with mixed materials (hybrid stackup)?
Yes. We routinely produce hybrid stackups combining FR-4 with Rogers (RO4350B/RO4003C) or PTFE materials. This is common for RF designs where only certain layers need low-loss substrates.
What file formats do you accept?
Gerber RS-274X (preferred), ODB++, Eagle .brd, KiCad .kicad_pcb, and Altium .PcbDoc. We provide free DFM review and will flag any issues before production.
How do you ensure impedance control accuracy?
We use pre-production Si9000 simulation to calculate trace geometry, then verify with TDR (Time Domain Reflectometry) testing on production coupons. Every impedance-controlled order ships with a test report.
Need Custom Capabilities?
Don't see your requirement listed? Our engineering team handles edge cases daily.
Upload your files or describe your project — we'll confirm feasibility within 24 hours.