Shengyi S1000-2 PCB Fabrication
High-Tg (180C) FR-4 with low Z-axis CTE (2.8%) for lead-free multilayer builds up to 30+ layers in automotive, server, and telecom

180C
Tg (DSC)
355C
Td
4.4
Dk @ 1 GHz
2.4%
CTE 50-260C
Key Features
- High-Tg 180C (DSC) / 185C (DMA) for superior thermal reliability
- Low Z-axis CTE (2.4% at 50-260C) for PTH via reliability in high-layer boards
- T260 >60 min, T300 >15 min handles aggressive reflow profiles
- UV blocking / AOI compatible
- IPC-4101/126 compliant, widely qualified across automotive and telecom OEMs
Applications
Shengyi S1000-2 is proven in production for: automotive ECUs, server motherboards, telecom base station cards, networking switches, high-layer-count backplanes (20-40 layers), industrial controllers.
How It Compares
S1000-2 is Shengyi's go-to high-Tg FR-4 for demanding multilayer applications. Compared to S1150G (Tg 150C), it offers 30C higher Tg and significantly better Z-axis CTE control. Against Isola 370HR (Tg 180C, Td 340C), S1000-2 matches the Tg and exceeds Td (355C vs 340C) at a 20-30% cost advantage.
Design Parameters
| Property | Value |
|---|---|
| Glass Transition (Tg) | 180C |
| Decomposition Temperature (Td) | 345C |
| T260 | >60 min |
| T288 | 20 min |
| CTE Z-axis (before Tg) | 45 ppm/C |
| CTE Z-axis (after Tg) | 220 ppm/C |
| CTE Z-axis (50-260C) | 2.8% |
| Dk | 4.4 |
| Df | 0.015 |
| Peel Strength (after 288C) | 1.3 N/mm |
| Flammability | UL 94 V-0 |
| IPC Specification | IPC-4101/126 |
Shengyi S1000-2 In Production
Genuine high-Tg S1000-2 multilayer boards we fabricate, and the thermally demanding systems they go into.

High-layer-count multilayer on S1000-2 — Tg 180C holds registration through 20-40 layer lamination.

Plated through-hole barrel: S1000-2 low Z-axis CTE (2.4% at 50-260C) protects PTH walls in lead-free reflow.

Server and telecom boards: S1000-2 Td 355C and T260 >60 min survive repeated high-temperature assembly.
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