Free Engineering Tool

Via Impedance Calculator

Estimate a via's characteristic impedance, parasitic capacitance and inductance from its physical dimensions using the coaxial approximation model. Verify whether your via geometry matches your target system impedance.

Coaxial model Impedance, C & L 50Ω match check Bandwidth estimate

Via Impedance Calculator

Enter pad diameter, antipad diameter, via length and Dk. Results update live.

Via Geometry

mil

Via land / capture pad OD

mil

Clearance hole in reference plane

mil

Standard 1.6mm ≈ 62 mil · for stub analysis use signal-to-exit distance

Effective Dk of material surrounding the via barrel

Cross-Section Model

Pad: 24 mil

Antipad: 40 mil

D_pad/D_antipad = coaxial ratio

Z = (60/√εr) × ln(D_ap/D_pad)

Results

Via Characteristic Impedance

15Ω

⚠ 35Ω from 50Ω — consider adjusting antipad size

Capacitance

0.719 pF

Inductance

0.476 nH

D_ap/D_pad Ratio

1.67

Ideal for 50Ω: ~2.0 in FR-4

BW Estimate

29.6 GHz

Capacitive 3dB bandwidth

50Ω Design Guide (FR-4, Dk≈4.2)

For Z_via ≈ 50Ω in FR-4: D_antipad/D_pad ≈ 2.0. Example: 24 mil pad → 48 mil antipad. Larger antipads raise impedance but reduce plane copper; smaller antipads lower impedance but increase return-path inductance at high speeds.

Coaxial approximation per Bogatin/Johnson. Accuracy is best for isolated vias with uniform dielectric. Real vias have additional fringing capacitance from pad lands on multiple layers, non-uniform Dk, and coupling to nearby vias/planes not captured by this model. For high-speed (>10 Gbps) designs, validate with 3D EM simulation.

The Model

Coaxial approximation for via impedance

A plated via passing through a ground plane looks like a short coaxial transmission line: the via barrel is the center conductor and the antipad clearance is the outer conductor. The formulas below are from Eric Bogatin's "Signal and Power Integrity" and are widely used for first-pass via modeling.

Impedance

Z = (60/√εr) × ln(D_ap/D_pad)

The ratio D_ap/D_pad is the dominant tuning variable.

Capacitance

C = 1.41×εr×T / ln(D_ap/D_pad)
T in inches → C in pF

Longer vias = more capacitance.

Inductance

L = 5.08×T × (1+ln(D_ap/D_pad))
T in inches → L in nH

Larger antipad = more inductance.

FAQ

Via impedance, answered

What determines a via's impedance?

The ratio of antipad to pad diameter and the surrounding Dk. Z = (60/√εr) × ln(D_ap/D_pad). For 50Ω in FR-4, target D_ap/D_pad ≈ 2.0.

How much capacitance does a typical via add?

A 62 mil via in FR-4 with 24 mil pad / 40 mil antipad adds about 0.5–0.7 pF. At 50Ω, each pF contributes ~7 ps of added delay.

Why does via impedance matter?

Mismatched vias reflect signal energy, degrading return loss and eye opening. At multi-gigabit rates, via impedance discontinuities accumulate across the channel.

How accurate is the coaxial model?

Good for first-pass design (±10–15%). It does not account for pad capacitance on multiple layers, non-circular clearances, nearby vias, or via fill. For 10 Gbps+ validation, use 3D EM simulation.

Optimized via design, built right

Controlled-impedance vias, precise antipad sizing, back-drilling — engineer-reviewed and TDR-verified. 1-piece MOQ.