· AtlasPCB Engineering · News · 3 min read
Korean PCB Equipment Maker Taesung Lands $4.75M China Contract as AI Server Board Demand Surges
Taesung Co. secures a KRW 7.1 billion ($4.75M) PCB wet-process equipment contract through its Zhuhai subsidiary, supplying etching and cleaning systems for AI server and FC-BGA substrate production in China.

Taesung Secures Major PCB Equipment Order in China
South Korean PCB automation equipment maker Taesung Co., Ltd. (KOSDAQ: 323280) announced on May 19, 2026, a PCB equipment supply contract worth KRW 7.1 billion (approximately $4.75 million USD) with an undisclosed Chinese customer, signed through its Zhuhai subsidiary TAESUNG (Zhuhai) Technology.
The contract represents approximately 18.86% of the company’s 2025 annual revenue, highlighting its significance to Taesung’s growth trajectory.
Contract Details
The agreement covers wet-process PCB equipment — specifically etching and cleaning systems — with delivery and support structured for multi-year engagement:
| Parameter | Detail |
|---|---|
| Contract value | KRW 7.1 billion (~$4.75M USD) |
| Duration | Through May 19, 2029 |
| Equipment type | Etching and cleaning (wet process) |
| Manufacturer | Taesung HQ (South Korea) |
| Local support | TAESUNG (Zhuhai) Technology |
Payment terms are structured as:
- 30% upon contract signing
- 30% before equipment acceptance
- 30% after equipment acceptance
- 10% one year after final acceptance (warranty holdback)
Why Wet-Process Equipment Demand Is Rising
The surge in demand for advanced etching and cleaning equipment is directly linked to PCB complexity growth:
AI Server PCBs Require Precision Etching
AI server boards (20-30+ layers) with fine features need:
- Line width/space accuracy: ±10 µm for 50/50 µm L/S patterns
- Etch uniformity: <5% variation across 600 mm panels
- Surface cleanliness: <100 ng/cm² ionic contamination for reliable plating
FC-BGA Substrate Demand
Flip-chip BGA substrates for AI chips require even finer processing:
- Feature size: 15-25 µm line/space (MSAP or SAP process)
- Layer count: 12-20 substrate layers
- Panel handling: Ultra-thin cores (50-100 µm) require gentle transport
The China Localization Factor
Taesung’s use of a Chinese subsidiary for local support reflects the broader trend of international equipment companies establishing on-the-ground presence in China’s PCB manufacturing belt. Chinese PCB manufacturers are investing heavily in capacity for:
- AI server boards (responding to hyperscaler demand)
- Advanced packaging substrates
- High-layer-count 5G infrastructure boards
Market Context
The PCB equipment market is experiencing a cyclical upswing:
- Global PCB production equipment spending exceeded $8 billion in 2025
- China accounts for approximately 55% of global PCB manufacturing capacity
- Wet process equipment represents 15-20% of a typical factory’s capital expenditure
- Korean equipment makers (Taesung, SFA, PSK) compete with Japanese (Tokyo Ohka, Screen) and European (Schmid, Atotech) suppliers
CEO Kim Jong-hak stated Taesung will continue expanding orders in its core PCB business while accelerating growth in new areas including glass substrates and composite copper foil materials — both essential for next-generation AI packaging.
Implications for the Supply Chain
This contract signals several industry trends:
- Chinese PCB factories are upgrading — The equipment purchase indicates new line installations or technology upgrades for finer-feature capabilities
- Korean equipment gaining share — Taesung’s 2023-established Zhuhai subsidiary is already generating significant contracts
- AI demand is real capex — Equipment orders with 3-year horizons confirm long-term conviction in AI PCB demand
- Localization accelerating — The subsidiary model (Korean manufacturing + Chinese service) balances cost, IP protection, and customer proximity
What This Means for Engineers Sourcing PCBs
Equipment upgrades at Chinese manufacturers translate to:
- Better fine-line capability (50/50 µm becoming mainstream)
- Improved yield on high-layer-count boards
- Faster delivery as production capacity expands
- More competitive pricing as efficiency improves
AtlasPCB works with factories that continuously invest in state-of-the-art wet-process equipment, ensuring consistent quality for HDI boards, high-layer-count designs, and advanced substrate requirements.
Source
- IC&PCB Union / Taesung KOSDAQ filing, May 19, 2026
Image: Remy Gieling via Unsplash
Need advanced PCB manufacturing with fine-line etching capability? AtlasPCB partners with factories equipped with latest-generation wet-process systems for 50/50 µm line/space and beyond. Request a quote for your high-density design.
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Reviewed by AtlasPCB Engineering Team — IPC-certified manufacturing specialists with 15+ years of production experience in HDI, RF, and high-reliability PCB fabrication. Content based on factory floor data and real customer design reviews.
- news
- PCB equipment
- AI server
- China manufacturing
- wet process
- etching
- substrate
- Korea


