SEMICON SEA 2026: Chinese PCB Companies Pivot to Advanced Packaging as 95+ Firms Showcase in Singapore

The fifth edition of SEMICON Southeast Asia, held May 5-7, 2026 at the MITEC Exhibition Centre in Kuala Lumpur, marked a turning point for the PCB industry’s relationship with advanced semiconductor packaging. Over 95 mainland Chinese companies exhibited at this year’s show — a record participation level that reflects the industry’s accelerating pivot from traditional PCB fabrication toward wafer-level packaging, IC substrates, and semiconductor-grade manufacturing.

From PCB to Advanced Packaging

The most notable trend among Chinese exhibitors was a wholesale repositioning away from “PCB manufacturer” branding toward semiconductor-oriented positioning. Companies from Shenzhen, Dongguan, Suzhou, and Shanghai dominated the exhibitor list, spanning semiconductor equipment, advanced packaging materials, IC substrates, cleanroom solutions, and precision automation.

Key exhibitors included Guangdong Taijin Semiconductor Technology, QUICK Semiconductor Technology, SiCentury Semiconductor Technology (Suzhou), and Macrotest Semiconductor Technology — many of which evolved from traditional PCB supply chain origins.

According to IC&PCB Union’s analysis of the event, the word “Semiconductor” has become a core keyword in Chinese company names, reflecting “the industry’s transition from traditional electronics manufacturing toward advanced packaging and wafer-level technologies.”

PCB Equipment Suppliers Enter Semiconductor Markets

While SEMICON SEA is not traditionally a PCB-focused exhibition, multiple Chinese PCB equipment and materials companies actively participated. Representatives included Dongguan Allmerit Technology, Wuxi KINGWIN Electronic Equipment, Shenzhen Tensun Precision Equipment, and Chip Shine Electronics Technology.

These companies are leveraging their PCB process expertise — in areas like laser drilling, plating, imaging, and wet processing — to address adjacent semiconductor packaging requirements where similar process technologies apply at finer geometries.

Delta Electronics Highlights AI in Packaging

In a parallel announcement, Delta Electronics presented its AI-integrated smart manufacturing solutions at the show. The company’s booth demonstrated how artificial intelligence enables “smarter, more connected, advanced semiconductor packaging production featuring greater speed, precision, and scalability,” according to their press release.

Delta’s presentation focused on power management and thermal solutions for advanced packaging production equipment — areas directly relevant to high-density PCB fabrication where similar thermal challenges exist.

ASMPT Showcases Full-Spectrum Solutions

ASMPT, under the theme “Empower the Intelligence Revolution,” exhibited semiconductor packaging, SMT assembly, and intelligent factory technologies targeting AI, Smart Mobility, and Hyperconnectivity applications. Their booth covered the full spectrum from die bonding to PCB assembly.

What This Means for PCB Engineers

The convergence of PCB and semiconductor packaging creates both challenges and opportunities:

• Substrate requirements are blurring — IC substrates use PCB manufacturing techniques (SAP/mSAP processes) at semiconductor tolerances
• Equipment is crossing over — Laser drill, plating, and inspection equipment designed for PCB is being adapted for packaging substrates
• Materials overlap — ABF build-up films, low-CTE glass cloth, and ultra-thin copper foils serve both markets
• Engineering talent is shared — PCB design skills translate directly to substrate design

For hardware engineers sourcing advanced substrates and HDI boards, this convergence means more fabricators are developing capabilities that bridge the gap between traditional multilayer PCBs and semiconductor-grade substrates.

AtlasPCB’s Position

At AtlasPCB, we’ve been investing in advanced HDI capabilities that overlap with IC substrate manufacturing — including mSAP processing for ≤30 μm trace/space, any-layer microvia technology, and ultra-thin core handling. As the line between PCBs and packaging substrates continues to blur, our manufacturing platform is positioned to serve both markets.

Explore Our HDI Capabilities → | Request a Quote →

Sources: IC&PCB Union, ASMPT Press Release, Delta Electronics / PRNewswire

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