PCB Detroit 2026: RF Design, EMI, and AI-Driven Workflows Lead Technical Sessions

PCB Detroit Returns for 2026

The PCB Detroit conference is returning to Wayne State University on June 15–16, 2026, featuring an expanded technical program that addresses both the enduring challenges of high-frequency design and the emerging reality of AI-integrated PCB workflows.

Announced via PCB UPdate, the two-day event includes sessions covering ESD protection, EMI mitigation, RF design techniques, thin copper foil impacts on manufacturing, thermal management strategies, signal integrity fundamentals, and — new for 2026 — AI-driven PCB design workflows.

Technical Program Highlights

The 2026 program reflects the PCB industry’s dual evolution: materials and processes growing more sophisticated while AI tools reshape how engineers interact with those complexities.

RF and High-Frequency Design

Sessions cover practical design guidance for 5G, automotive radar, and satellite communications PCBs, including:

Material selection for mmWave frequencies (Rogers, Taconic, hybrid stackups)
Transmission line loss optimization above 20 GHz
Via transition design for minimal signal degradation
Antenna-in-package PCB considerations

EMI and ESD

Electromagnetic interference remains the most common cause of PCB redesigns. Sessions address:

Board-level shielding techniques (via fencing, ground pours, shield cans)
ESD protection circuit placement and grounding strategies
Common-mode noise rejection in high-speed differential pairs
Regulatory compliance testing methodologies

Thin Copper and Advanced Materials

As circuit densities increase, manufacturers push toward thinner copper foils (9 μm and 5 μm). Sessions explore:

Manufacturing process adjustments for ultra-thin foil
Impact on impedance control and etching uniformity
Reliability considerations for thin conductors under thermal stress
HVLP and VLP foil options for high-frequency applications

AI-Driven PCB Workflows

The newest track acknowledges AI’s rapid integration into hardware design:

Practical applications of AI in component placement optimization
Machine learning for DFM rule generation and verification
AI-assisted routing for complex high-speed topologies
Integration of AI tools with traditional EDA workflows

Thermal Management

With power densities increasing across all electronics segments:

Thermal via array design for power module boards
Metal-core and insulated metal substrate technologies
Simulation-driven thermal optimization
Material selection for high-temperature applications

Why Industry Events Matter in the AI Era

While AI tools are automating routine PCB design tasks, conferences like PCB Detroit serve a function that AI cannot replicate: facilitating cross-pollination between RF specialists, manufacturing engineers, reliability experts, and tool vendors.

The addition of AI workflow sessions alongside traditional RF and EMI topics reflects a pragmatic reality — engineers need to understand both the physics of their designs and the new tools available to implement them more efficiently.

Conference Details

Dates: June 15–16, 2026
Location: Wayne State University, Detroit, Michigan
Registration: Open via PCB UPdate
Format: In-person technical sessions with hands-on demonstrations
Related events: PCB West (September 2026, Santa Clara) and PCB East (Worcester) continue their annual programs

Relevance to AtlasPCB Customers

For hardware engineers attending or tracking these events, AtlasPCB offers relevant manufacturing capabilities across the topics covered:

RF/microwave fabrication — Rogers, Taconic, and hybrid stackups with controlled impedance to 67 GHz
EMI-optimized boards — via fencing, controlled impedance, and board-level shield integration
Thin copper processing — 9 μm and 5 μm foil capability for HDI and fine-line applications
Thermal solutions — heavy copper (up to 10 oz), metal-core boards, and thermal via optimization

Source: PCB UPdate (May 2026)

Image: ThisisEngineering via Unsplash