Fujifilm Introduces PFAS-Free PBO Packaging Materials at ECTC 2026

Fujifilm Corporation announced on May 26, 2026 that it will present new semiconductor packaging research findings and introduce PFAS-free polybenzoxazole (PBO) within its ZEMATES™ product line at the 76th IEEE Electronic Components and Technology Conference (ECTC 2026), taking place May 26-29 in Orlando, Florida.

The development addresses a critical industry challenge: transitioning away from per- and polyfluoroalkyl substances (PFAS) in semiconductor manufacturing while maintaining the electrical and mechanical performance that advanced packaging demands.

Why PFAS-Free Matters for Electronics Manufacturing

PFAS compounds — often called “forever chemicals” — have been widely used in semiconductor processing for their chemical resistance and low surface energy properties. However, regulatory pressure is mounting globally:

• EU PFAS restriction proposal (European Chemicals Agency): Broad ban covering thousands of substances, potentially effective 2027-2028
• US EPA PFAS Strategic Roadmap: Increasing reporting requirements and potential manufacturing restrictions
• Japan PFAS regulation: New reporting thresholds for fluorinated compounds in electronics materials

For PCB substrate manufacturers and semiconductor packaging houses, the transition to PFAS-free materials is no longer optional — it’s a compliance timeline issue.

ZEMATES Product Line: Performance Without PFAS

Fujifilm’s ZEMATES photosensitive insulating materials serve as redistribution layer (RDL) dielectrics and passivation layers in advanced packages. The PFAS-free PBO variant addresses:

• Fan-out wafer-level packaging (FOWLP): RDL dielectric layers requiring fine photolithographic patterning
• 2.5D interposer fabrication: Insulating layers between copper redistribution layers
• Chiplet integration: Passivation and stress buffer layers in multi-die packages
• High-bandwidth memory (HBM) stacking: Dielectric layers in silicon interposers

PBO (polybenzoxazole) is preferred for advanced packaging due to its:

• Low dielectric constant (Dk ≈ 2.9-3.1 at 1 GHz)
• High thermal stability (decomposition > 450°C)
• Excellent adhesion to copper metallization
• Fine-pattern photolithographic capability (< 5μm resolution)

Technical Presentations at ECTC 2026

Fujifilm’s ECTC program includes research papers covering:

1. PFAS-free PBO formulation chemistry: Alternative fluorine-free surfactants and photoinitiator systems that maintain photosensitivity and resolution
2. Reliability validation: Thermal cycling, biased humidity testing (HAST), and adhesion testing compared to PFAS-containing baseline formulations
3. Process compatibility: Integration with existing semiconductor packaging lines without process modifications

Industry Implications for PCB and Substrate Manufacturing

The PFAS-free transition extends beyond semiconductor packaging into PCB substrate manufacturing:

• Solder mask formulations: Many high-performance solder masks contain PFAS-based leveling agents
• PTFE-based RF laminates: PTFE (polytetrafluoroethylene) itself is a fluoropolymer under scrutiny
• Surface treatment chemistry: Some ENIG and ENEPIG processes use fluorinated wetting agents
• Conformal coatings: Fluoroacrylate coatings face regulatory review

PCB manufacturers that depend on PFAS-containing materials should evaluate alternatives now, before regulatory deadlines force abrupt material changes that could affect product qualification.

AtlasPCB’s Material Transition Readiness

At AtlasPCB, we are actively qualifying PFAS-free alternatives across our process chain, including solder mask, surface treatment, and cleaning chemistries. For designs requiring advanced substrate materials, we work with laminate suppliers who are developing compliant alternatives that maintain electrical performance.

Need PCBs manufactured with environmentally compliant materials? Contact our engineering team → to discuss PFAS-free material options for your application.

Learn more about our manufacturing capabilities: AtlasPCB Capabilities →

Source: Fujifilm Corporation Press Release, May 21, 2026

Image: ThisisEngineering via Unsplash