Amphenol Printed Circuits to Showcase Large-Format RF and Microwave PCBs at IMS 2026

Amphenol Brings 40-Inch Phase-Matched PCBs to IMS 2026

Amphenol Printed Circuits (APC) will present its high-performance PCB design and manufacturing technologies at the 2026 IEEE MTT-S International Microwave Symposium (IMS), taking place June 9–11 at the Thomas M. Menino Convention & Exhibition Center in Boston.

The company will exhibit at Booth #16054, displaying PCBs for RF/microwave applications and high-speed digital (HSD) circuits — including a large-format assembly exceeding 40 inches in length with tightly amplitude- and phase-matched channels for radar and satellite systems.

What’s on Display

APC’s exhibit will showcase PCB technologies spanning multiple application domains:

• Terrestrial radar: Large-format arrays with amplitude/phase matching
• Maritime electronics: Boards handling salt spray and vibration environments
• Space applications: Materials qualified for outgassing and radiation
• Flex and rigid-flex circuits: SWaP-optimized assemblies (Size, Weight, and Power)
• SMT assemblies: Integrated RF front-end modules

The highlight appears to be the 40+ inch assembly — a notably large PCB panel that requires exceptional dimensional stability and thermal management to maintain phase matching across all channels.

Why Large-Format RF PCBs Are Technically Challenging

Manufacturing large-format RF boards (>500 mm) with tight phase matching pushes multiple process limits simultaneously:

Dimensional Stability

• Large panels experience more total thermal expansion during lamination and reflow
• CTE mismatch between PTFE-based RF materials and copper creates bow/twist
• Panel warpage must stay below 0.5% for reliable automated assembly
• Registration tolerance accumulates over 1000+ mm panel dimensions

Phase Matching Requirements

• Radar arrays require matched electrical length within ±0.5° at operating frequency
• At 10 GHz, ±0.5° phase = ±42 µm trace length difference
• Dielectric constant (Dk) uniformity must be held to ±0.02 across the entire panel
• Copper thickness variation directly affects impedance and phase velocity

Material Selection

• Low-loss PTFE-based laminates (Rogers, Taconic) are standard for RF
• Large-format panels in PTFE are more expensive and harder to handle than FR-4
• Hybrid stackups (PTFE signal layers + FR-4 structural layers) reduce cost
• Material lot-to-lot Dk variation must be characterized and compensated

Manufacturing Scale

• Few PCB factories worldwide can process 1000+ mm panels with RF precision
• Equipment limitations: drill tables, exposure units, etching tanks all sized for standard panels
• Handling: manual transport required for oversize panels, increasing defect risk

IMS 2026 Workshop Participation

Colby Hobart, APC’s RF Applications Engineer, will participate in the workshop “Next-Generation RF Components: Strategies to Minimize Loss, Noise, and Distortion” on Thursday, June 11 (1:30–3:10 p.m., Room 154), alongside representatives from other Amphenol business units.

“Most engineers are searching for ways to make things smaller, such as for reduced SWaP. But we have also had design and manufacturing inquiries for PCBs headed in the opposite direction,” Hobart noted, referencing growing demand for large-format assemblies in defense radar and satellite applications.

Industry Context: Defense RF PCB Market

The defense and aerospace PCB market is experiencing sustained growth:

• US defense spending on electronic warfare and radar systems increased 12% in FY2026
• Phased array radars are replacing mechanically-scanned dishes across all branches
• AESA (Active Electronically Scanned Array) systems require thousands of individually-matched RF channels on large-format PCBs
• Satellite ground stations for LEO constellation management need wideband, phase-stable antenna feed networks

The trend toward larger, more integrated PCB assemblies in defense electronics creates opportunities for manufacturers with the equipment and expertise to handle oversize panels.

Relevance to PCB Engineers

For engineers designing RF and microwave circuits:

1. Large-format is viable: Assemblies >40 inches demonstrate that PCB manufacturing can support antenna-scale integration
2. Phase matching is achievable: ±0.5° across large panels is production-ready, not just lab-scale
3. Hybrid material stackups work: Mixing RF and structural layers enables cost-effective large panels
4. SWaP reduction continues: Rigid-flex and SMT integration eliminate connectors and cables

AtlasPCB manufactures RF PCBs using Rogers, Taconic, and other high-frequency laminates with controlled impedance and tight Dk tolerance. For RF and microwave designs, our engineering team provides material selection guidance and DFM review.

Source

• PCB Directory / Amphenol Printed Circuits press release, May 21, 2026
• IEEE IMS 2026 Conference Program

Image: Nicolas Thomas via Unsplash

Designing RF or microwave PCBs? AtlasPCB specializes in Rogers and PTFE-based laminates with controlled impedance, phase matching, and rigorous RF testing. Get a quote for your high-frequency design or explore our RF PCB capabilities.