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American Standard Circuits to Showcase RF and High-Frequency PCB Technologies at IMS 2026 in Boston

American Standard Circuits will exhibit advanced RF, microwave, and millimeter-wave PCB manufacturing capabilities at IEEE IMS 2026, June 8-13 in Boston, highlighting solutions for 5G, aerospace, and defense applications.

American Standard Circuits will exhibit advanced RF, microwave, and millimeter-wave PCB manufacturing capabilities at IEEE IMS 2026, June 8-13 in Boston, highlighting solutions for 5G, aerospace, and defense applications.

American Standard Circuits Heads to IMS 2026

American Standard Circuits (ASC), a leading North American PCB manufacturer specializing in high-reliability and advanced technology boards, has announced its participation at IEEE IMS 2026 (International Microwave Symposium). The event runs June 8–13, 2026, at the Thomas M. Menino Convention and Exhibition Center in Boston, Massachusetts.

ASC will exhibit at Booth 23056, where attendees can learn about the company’s PCB manufacturing solutions for RF, microwave, millimeter-wave, aerospace, defense, medical, telecommunications, and next-generation electronic applications.

“We are very excited to participate in IMS 2026,” said Anaya Vardya, President and CEO of American Standard Circuits. “This event represents one of the most important gatherings for the high-frequency electronics industry and gives us the opportunity to showcase the advanced technologies and manufacturing capabilities that American Standard Circuits brings to the marketplace.”

Why IMS Matters for PCB Engineers

IEEE IMS is the world’s premier event for RF, microwave, and high-frequency technologies, bringing together engineers, researchers, OEMs, and technology companies to explore:

  • 5G/6G infrastructure: mmWave antenna arrays, beamforming boards, front-haul/back-haul equipment
  • Satellite communications: LEO constellation electronics, phased array radar
  • Automotive radar: 77 GHz ADAS PCBs with PTFE/hydrocarbon hybrid stackups
  • Defense electronics: Electronic warfare, SIGINT, wideband receivers
  • Test and measurement: VNA calibration substrates, probe cards

For PCB engineers, IMS is where laminate manufacturers (Rogers, Taconic, Isola), EDA vendors, and fabricators converge to discuss the materials and manufacturing techniques enabling the next generation of high-frequency hardware.

RF PCB Manufacturing Challenges in 2026

High-frequency PCBs present unique manufacturing challenges that set them apart from standard digital boards:

Material handling: PTFE-based laminates (Rogers RT/duroid, Taconic TLY) have different processing requirements than FR-4. Drilling, plating, and etching parameters must be adjusted for each material system.

Mixed-material stackups: Modern RF designs often combine low-loss RF layers (Rogers 4350B, Megtron 7) with standard FR-4 for digital/power sections. Managing CTE mismatch and registration between dissimilar materials requires specialized lamination expertise.

Tight impedance tolerance: RF circuits often require ±3–5% impedance control (vs. ±10% for standard digital), demanding tighter process control on trace width and dielectric thickness.

Via transitions at mmWave: At 28 GHz and above, via inductance and mode conversion become critical. Backdrill depth control, via stub elimination, and precision laser drilling are essential.

Surface finish for RF: ENIG, immersion silver, and specific gold thicknesses affect conductor loss at microwave frequencies. Surface roughness (foil profile selection) directly impacts insertion loss above 10 GHz.

AtlasPCB’s RF PCB Capabilities

While American Standard Circuits showcases their capabilities at IMS, AtlasPCB also serves the high-frequency PCB market with:

  • Rogers, Taconic, Isola RF laminates in stock
  • Hybrid stackups: PTFE + FR-4 mixed dielectric construction
  • Impedance tolerance: ±5% on 50Ω and 100Ω differential
  • Precision etch: ±0.5 mil trace width control for mmWave
  • HVLP copper foil: Low-roughness options for minimal conductor loss
  • Backdrill: Controlled-depth drilling for via stub removal

For RF and microwave PCB projects that require quick-turn prototyping with hybrid material expertise, our engineering team provides DFM review and stackup optimization at no cost.


Source: PCB Directory, June 3, 2026

Image: Robin Glauser via Unsplash


Working on an RF or microwave PCB design? AtlasPCB provides hybrid-material stackups with Rogers, Taconic, and Megtron laminates, plus precision impedance control for mmWave applications. Get a quote or review our RF PCB capabilities.

About AtlasPCB — We specialize in complex PCB manufacturing for HDI, RF, and high-reliability applications. Explore our RF and high-frequency PCB services . Every order includes free engineering review. Get your quote.

Reviewed by AtlasPCB Engineering Team — IPC-certified manufacturing specialists with 15+ years of production experience in HDI, RF, and high-reliability PCB fabrication. Content based on factory floor data and real customer design reviews.

  • news
  • IMS 2026
  • RF PCB
  • microwave
  • American Standard Circuits
  • high-frequency
  • 5G
  • aerospace
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