The shift to chiplet-based architectures and 2.5D/3D packaging is creating new demands for PCB substrates, blurring the boundary between traditional PCBs and semiconductor packaging with implications for materials, design rules, and manufacturing processes.
The explosive growth of AI/ML training and inference hardware is pushing PCB layer counts to new extremes, with 40-68 layer boards becoming standard for next-generation GPU and ASIC platforms.
Evolving automotive safety standards and the proliferation of ADAS, EV power electronics, and autonomous driving systems are driving stricter PCB reliability requirements, with implications for materials, testing, and manufacturing processes.
A roundup of key IPC standards updates in 2026, including revisions to IPC-6012, IPC-2581, and new standards addressing advanced packaging, microvia reliability, and sustainability requirements.
The global 5G infrastructure rollout and emerging 5G-Advanced deployments are driving strong demand for high-frequency PCBs on specialty substrates, creating opportunities and challenges for PCB manufacturers.
NASA's Artemis II mission confirmed that radiation-hardened semiconductors performed flawlessly beyond Earth orbit. Here's why PCB reliability standards matter more than ever for aerospace applications.
Chinese semiconductor equipment suppliers posted record 2025 revenues as domestic fabs expanded capacity. What this means for PCB fabrication capacity, material sourcing, and global supply chains.
Key takeaways from the Global Electronics Association's APEX EXPO 2026 — from AI-driven manufacturing to heterogeneous integration and the evolving role of PCBs in advanced packaging.
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