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5G Communication Antenna Board Telecommunications

5G Communication Antenna Board

High-frequency 18-layer antenna PCB for 5G base stations using Rogers RO4350B and mixed dielectric stackup, with precision impedance control for mmWave signal performance.

5g high-frequency antenna rogers telecommunications

Project Overview

A telecommunications equipment manufacturer needed high-performance antenna boards for their 5G NR (New Radio) base station platform operating in both sub-6GHz and mmWave frequency bands. The boards required mixed-dielectric construction combining Rogers high-frequency materials with standard FR-4 for cost optimization.

Challenge

  • mmWave performance: Antenna elements and feed networks operating at 24-28 GHz required extremely low insertion loss and precise impedance control that standard FR-4 cannot achieve.
  • Mixed dielectric stackup: Combining Rogers RO4350B (for RF layers) with standard TU-872SLK (for digital/power layers) created manufacturing complexity in lamination and drill registration.
  • Tight tolerances: Antenna element dimensions needed +/-0.5 mil accuracy to maintain radiation pattern specifications across the operating bandwidth.
  • Step gold finger: The board-to-board interface required partial gold plating with step thickness (30u” contact area, 5u” transition), adding process complexity.

Solution

NimblePCB leveraged specialized high-frequency manufacturing capabilities for this demanding telecommunications application:

  • Hybrid stackup design: 18-layer construction with Rogers RO4350B on the top 4 layers for antenna and RF feed network, transitioning to TU-872SLK for remaining layers. Sequential lamination process ensured layer-to-layer registration within +/-2 mil.
  • RF precision: Achieved +/-3% impedance tolerance on 50-ohm microstrip lines at 28 GHz. Antenna element features fabricated with +/-0.3 mil dimensional accuracy using laser direct imaging (LDI).
  • Step gold plating: Selective electroplating process with precision masking for dual-thickness gold fingers, verified by XRF measurement at multiple points per board.
  • Controlled environment: All RF laminate handling and processing done in temperature/humidity controlled cleanroom environment to prevent material property variation.

PCB Specifications

ParameterValue
Layers18
RF MaterialRogers RO4350B
Digital MaterialTU-872SLK
Board Thickness2.8 mm
Min Trace/Space3/3 mil
Surface FinishPartial gold plating (step)
Impedance ControlYes, +/-3%
Frequency RangeSub-6GHz + 24-28 GHz

Results

  • Antenna radiation pattern matched simulation within 0.5 dB across full bandwidth
  • Insertion loss 15% lower than customer’s previous supplier
  • Step gold finger contact resistance met specification across 500+ mating cycles
  • Qualified as primary supplier for the customer’s 5G base station program

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